Sole leader in providing particle-controlled image sensor in-line assembly solutions
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Automatic Die Bonding System (12” wafer handling)
Automatic DI-Water Cleaning System
Automatic Lens Holder Attach System
Automatic Active Alignment Bonding System for Camera Module Assembly
UV Grooving System
High Speed Wire Bonder for Wider Substrate
Wire Bonder
Dual-Head Extreme High Speed Wire Bonder
UV Dicing???? System
Automatic Active Alignment System (for Automotive Camera Application)
Automatic 3D Sensing Alignment System
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