ASMPT's complete portfolio of wafer level and panel level packaging technologies, ranges from pick & place to large format mold, stencil print, ball drop, singulation and test & finish.
Multi-Purpose Precision Pick & Place Tool
Automatic Thermal Compression Bonding System
Encapsulation Solution for Large Format Packaging
Fully Automatic Turret Sorting Handler
PVD 200-300 mm Wafer Processing
PVD 100-200 mm Wafer Processing
PVD Semi Automated Substrate Processing
ECD 510 x 515 mm Panel Processing
ECD 300 - 200 mm Wafer Processing
ECD 100 – 200 mm Wafer Processing
ECD 300 – 200 mm Wafer Processing
