ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.
Automatic Active Alignment System (for Automotive Camera Application)
Automatic 3D Sensing Alignment System
For High-end IC Applications
Automatic Active Alignment Bonding System for Camera Module Assembly
Automatic Lens Holder Attach System
Automatic DI-Water Cleaning System
Automatic Die Bonding System (12” wafer handling)
Dual-Head Extreme High Speed Wire Bonder
Wire Bonder
Wire Bonder